# Companies at International Conference on Electronic Packaging Technology (ICEPT)

16 organisations named on published listings for International Conference on Electronic Packaging Technology (ICEPT): 2 sponsors and 14 companies on stage.
From the listings International Conference on Electronic Packaging Technology (ICEPT) prints on its own site. No registration data, and no individual attendees. Being listed is not an endorsement.
Last checked 2026-08-08. 5 August 2026 to 7 August 2026, Xi'an, China.

This event has ended.

## Sponsors and partners (2)

- IEEE
- EMPT

## Companies on stage (14)

- ASE (Advanced Semiconductor Engineering)
- Fudan University
- Tsinghua University
- Pacrim Technology Irvine
- Harbin Institute of Technology
- Huawei Technologies Düesseldorf GmbH
- Intel
- NXP Semiconductors
- Fraunhofer IZM
- Prismark
- Renesas Electronics Corporation
- Southeast University
- Huatek
- Ltd.

International Conference on Electronic Packaging Technology (ICEPT) is a trademark of its organiser. This page is an independent summary of listings published for the event. Being listed here is not an endorsement of the event, of Luminik, or of anything else. Luminik is not affiliated with the event.

Source page: https://www.luminik.io/events/international-conference-on-electronic-packaging-technology/companies/
Event page: https://www.luminik.io/events/international-conference-on-electronic-packaging-technology/