# International Symposium on Microelectronics and Packaging (ISMP cor)

- Dates: 3 November 2026 to 6 November 2026
- Location: Paradise Hotel Busan, Korea, Busan, South Korea
- Organiser: KMEPS
- Industry: Hardware & IoT

## About

The 24th International Symposium on Microelectronics Packaging (ISMP 2026) is a conference focused on microelectronics packaging. It is organized by the Korean Microelectronics Packaging Society and includes plenary, keynote, and invited speakers. The event is intended for professionals and researchers in the microelectronics packaging field.

## Official links

- [Official website](https://www.ismp.or.kr/html/)
- [Registration](https://www.ismp.or.kr/html/?pmode=registration)

## Speakers

- Terry Kang, Member of Technical Staff, OpenAI Inc., USA
- Ji Yong Park, Vice President, SK hynix Inc., Korea
- Bill En, Corporate Vice President, AMD (Advanced Micro Devices, Inc.), USA
- KyungRok Park, Corp. Vice President, Amkor Technology Korea, Inc., Korea
- Zsolt Tokei, Fellow, IMEC (Interuniversity Microelectronics Centre), Belgium
- Won Kyoung Choi, Vice President, Samsung Electronics Co., Ltd., Korea
- Nandish Mehta, Senior Research Scientist, NVIDIA Corporation, USA
- Chris Scanlan, Senior Vice President, BESI (BE Semiconductor Industries NV), Switzerland

## Sponsors and partners

- LG화학

## Where to stay

- **EZSTAY Nampo Hotel**: 240 m from the venue, 30-13 광복로67번길, 부산광역시, 48949
- **Hotel Foxy**: 360 m from the venue
- **Elysee Hotel**: 360 m from the venue
- **Aria Hotel**: 370 m from the venue
- **So Yu Hotel**: 410 m from the venue
- **Boutique Hotel YTT**: 410 m from the venue
- **Sam won jung**: 420 m from the venue
- **그리핀베이호텔**: 430 m from the venue, 3 stars

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Source: https://www.luminik.io/events/international-symposium-on-microelectronics-and-packaging-busan/