# Semiconductor Equipment, Core Components & Materials Exhibition (CSEAC)

- Dates: 31 August 2026 to 2 September 2026
- Location: Wuxi Taihu International Expo Center, Wuxi, China
- Organiser: CSEAC Organizing Committee
- Industry: Hardware & IoT
- Expected attendance: 120,000

## About

The Semiconductor Equipment, Core Components & Materials Exhibition is a premier event in the semiconductor industry, taking place at the Wuxi Taihu International Expo Center in Wuxi, China.

## Official links

- [Official website](https://www.cseac.org.cn/)
- [Registration](https://reg.fengm.cn/activity?id=OQIYI8)

## Topics

- Industrial Engineering
- Electric & Electronics

## Speakers

- Jin Cunzhong, Executive Deputy Secretary General, China Electronics Special Equipment Industry Association
- Wang Hui, Chairman
- Dr. Yin Zhiyao, Chairman and Chief Executive Officer, SMIC Semiconductor Equipment (Shanghai) Co
- Chu Junhao, Academician, Chinese Academy of Sciences (CAS)
- Wang Yanqing, Chairman, Pioneer Holding Group Co., Ltd. - Wuxi Pioneer Group
- Wang Jian, General Manager, Shengmei Semiconductor Equipment (Shanghai) Co
- Dr. Li Jinxiang, Deputy Secretary General, China Electronic Specialized Equipment Industry Association
- Chen Lu, Chairman, Shenzhen Zhongke FMS Technology Co
- Li Wei Ming, Vice Chairman and Chief Technology Officer, Jiangsu Microguide Nano Technology Co
- Zhang Yucheng, General Manaper, Suzhou iWISEETEC.Co..Ltd
- Yang Feng, General Manager and CEO, Reilly Scientific Instruments (Shanghai) Co
- Zhang Xiaoyong
- Nie Xiang, Qingdao Sifang Sirui Intelligent Technology Co., Ltd
- Xu Kaidong, Chairman and CEO, Jiangsu Luwen Instrument Co., Ltd
- Zheng Jun, CEO, Jushi Technology (Shanghai) Co., Ltd
- Ye Guoguang, Deputy General Manager, Wuxi Yiwen Electronic Technology Co., Ltd
- Yuan Yipei, Co President, Xinxin Financial Leasing Co., Ltd
- Ding Xiaorong, Chairman, Wenzhou Bangxinyuan Technology Co., Ltd

## Where to stay

- **凯里亚德酒店**: 950 m from the venue
- **亚朵酒店**: 980 m from the venue
- **Habbo Hotel**: 980 m from the venue
- **Deacon House**: 1.0 km from the venue, 335
- **锦江大酒店**: 1.0 km from the venue
- **如家酒店**: 1.1 km from the venue
- **全季酒店**: 1.1 km from the venue
- **美丽都大酒店（已拆迁）**: 1.1 km from the venue

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Source: https://www.luminik.io/events/semiconductor-equipment-core-components-materials-exhibition/