Hardware & IoT
International Conference on Electronic Packaging Technology (ICEPT)
ICEPT 2026 is the 27th International Conference on Electronic Packaging Technology, scheduled for August 5th to 7th, 2026 in Xi'an, China. The page describes it as a packaging technology conference for attendees interested in electronic packaging technology.
The essentials
Event details
- Dates
- 5 August 2026 to 7 August 2026
- Location
- Xi'an, China
- Organiser
- Beijing Herogees Consulting Company
- Industry
- Hardware & IoT
Public discussion
What people are saying
- VideoICEPT 2026 will be held on August 5-7th in Xi'an China!
The International Conference on Electronic Packaging Technology (ICEPT) is a prestigious global academic and technical platform dedicated to advancing research, innovation, and collaboration in ...
Agenda themes
Topics covered
- Electric & Electronics
On stage
Speakers
- Scott CHEN, Senior Vice President of Engineering, ASE (Advanced Semiconductor Engineering), Taiwan, China
- Zhuo LI, Professor, Fudan University, China
- Jusheng MA, Professor, Tsinghua University, China
- Wei Koh, Founder, Pacrim Technology Irvine, CA, USA
- Chenxi WANG, Professor, Harbin Institute of Technology, China
- Torsten Wipiejewski, Director, Huawei Technologies Düesseldorf GmbH, Germany
- Jeffrey C. Suhling
- Shaw Fong Wong, Dr, Intel, Malaysia
- Eu Poh Leng, Senior Director of External Package Innovation, NXP Semiconductors, Malaysia
- Tanja Braun, Head of Department, Fraunhofer IZM, Germany
- Yu-Po Wang, Principle Consultant, Prismark, USA
- Kazuyuki Nakagawa, Senior Manager, Packaging & Assembly Division, Renesas Electronics Corporation, Japan
- Jiexun YU, Doctoral candidate at School of Integrated Circuits, Tsinghua University, China
- Jun Yang, Chair, Southeast University
- Liang JIA, Director in Semiconductor BU, Huatek, China
- Guangchao Lv, Senior R&D Engineer, National Center for Advanced Packaging Co., Ltd., China
- Michael Liu, Product Director, Empyrean Technology Co., Ltd, China
- Keren Zhu, Assistant Professor, Fudan University, China
On the floor
Sponsors and partners
- 西安交通大学
- IEEE
- EMPT
- 西安微电子学院
- 华进半导体
- 陕西省半导体行业协会
- 恒仁致信
Logistics
Where to stay
Places to stay near the venue.
Safiya Hotel
锦江西京国际饭店
西安钟楼福朋喜来登酒店
79 西大街
西安东舍酒店
Traveling with Hotel South Gate
Mehood Lestie Hotel Bell Tower Xi’an
79 西大街
百合快揵酒店
59号 南仓南巷
悦顺民宿
北广济街
Keep planning
Related events
Spot something wrong on this page? Report a correction and we will fix it.