Hardware & IoT

Device Packaging Conference 2027

The Device Packaging Conference is a flagship annual event for leaders and innovators in microelectronics, advanced packaging, and system integration. It offers opportunities for collaboration, knowledge exchange, and advancement across the microelectronics packaging ecosystem.

5 months until it opens, and the call for speakers closes before that.

The essentials

Event details

Dates
1 March 2027 to 4 March 2027
Address
5594 W Wild Horse Pass Blvd., Phoenix, AZ 85226
Organiser
IMAPS
Expected attendance
475
Industry
Hardware & IoT

Who attends

The audience

People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professionals.

As described by the organiser

Public discussion

What people are saying

Speaking

Call for speakers

Submissions close 2026-10-09. Speaking slots are open for this event.

Agenda themes

Topics covered

  • Packaging
  • Aging

Plan the spend

Tickets

Ticket tiers, as published by the organiser:

Group RateUSD 339

Logistics

Where to stay

Places to stay near the venue.

Stay on it

Get the next edition

When Device Packaging Conference 2027 announces its next edition, or these dates change, we read it from the organiser's own site. One email when that happens, nothing else.

One email per announcement. Unsubscribe in a click, and we never pass your address on.

Plan this event

Work out who to meet here

Luminik sources the attendee picture for an event like Device Packaging Conference 2027, enriches it against your ICP, and sequences it ahead of the date. Capture at the event writes to Salesforce or HubSpot the same day, and attribution ties the pipeline back to the spend.

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