Manufacturing
IC Packaging Fair
The IC Packaging Fair (ICPF) displays advanced equipment and materials for the entire semiconductor packaging and testing process, offering one-stop solutions. It connects upstream and downstream resources, helping exhibitors develop new customers and promoting cooperation in the packaging and testing industry, with over 3,000 buyers from Chinese local OSAT and IDM attending.
The essentials
Event details
- Dates
- 27 October 2026 to 29 October 2026
- Address
- Guangdong Province, Shenzhen, Baoan, 福海街道展城路1号 邮政编码: 518103
- Organizer
- NEPCON ASIA
- Industry
- Manufacturing
- Website
- nepconasia.com
- Agenda
- View the agenda
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Before you go
Who's attending IC Packaging Fair?
We track who's exhibiting, sponsoring and speaking at IC Packaging Fair. Tell us who you sell to and we'll send you the people there worth meeting, usually within 24 hours.
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Agenda themes
Topics covered
- Mount Technology & Equipment
- Soldering Equipment
- Dispensing & Coating Equipment
- Test & Measurement Equipment
- Others of SMT
- Anti-static Equipment and Materials
- Electronic Manufacturing Services (EMS)
- IC Packaging Equipment
- Smart Factory & Automation Technology
- Robotics
- Motion Control Equipment
- Automation System Integration Solution
Logistics
Where to stay
Places to stay near the venue.
Shenzhen International Elite Hotel
花园格兰云天大酒店 ★★★★
深圳大中华希尔顿酒店 ★★★★★
1003号 深南大道, 深圳市
深圳星语太空舱酒店
284 Fuhua Road
上海宾馆
3032号 深南中路, 深圳市, 518031
Fraser Suites
格兰云天大酒店
3024号 深南中路, 深圳市, 518031
希岸酒店
For organizers
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