Manufacturing

IC & SENSOR PACKAGING EXPO JAPAN - CHIBA

This exhibition and technical conference focuses on IC final manufacturing. It gathers advanced equipment, materials, and services for IC and sensor packaging technology. The event is for industry professionals.

Official websiteRegisterAgenda
6 weeks until it opens.

The essentials

Event details

Dates
9 September 2026 to 11 September 2026
Location
Makuhari Messe - Nippon Convention Center, Chiba, Japan
Organiser
RX Japan GK NEPCON JAPAN Show Management
Industry
Manufacturing

Agenda themes

Topics covered

  • electronic design
  • R&D
  • manufacturing
  • semiconductor
  • packaging
  • pcb
  • smt
  • Asia
  • exhibition
  • Japan

Logistics

Where to stay

Places to stay near the venue.

  • ザキューブホテル千葉

    580 m from the venue

    45, 千葉市, 260-0025

    MapHotel site+81-43-246-1888

  • アパホテル

    710 m from the venue

    Map

  • Monselaton

    820 m from the venue

    Map

  • 京成ホテルミラマーレ

    840 m from the venue

    Map

  • ダイワロイネットホテル千葉中央

    870 m from the venue

    Map

  • Bali An RESORT

    920 m from the venue

    Map

  • 三恵シテイホテル

    1.2 km from the venue

    Map

  • オークラ千葉ホテル

    1.2 km from the venue

    Map

Keep planning

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