Manufacturing

IC & Sensor Packaging Expo Japan - Nagoya

The IC & Sensor Packaging Technology Expo is an exhibition focused on advanced equipment, materials, and services for IC final manufacturing. It is intended for industry professionals involved in IC and sensor packaging technology. The event includes a technical conference planned by industry experts.

4 months until it opens.

The essentials

Event details

Dates
25 November 2026 to 27 November 2026
Organiser
RX Japan
Industry
Manufacturing

Agenda themes

Topics covered

  • electronic design
  • R&D
  • manufacturing
  • semiconductor
  • packaging
  • pcb
  • smt
  • Asia
  • exhibition
  • Japan

Logistics

Where to stay

Places to stay near the venue.

Keep planning

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