Hardware & IoT

IC & Sensor Packaging Expo Japan - Osaka

Asia’s Leading Exhibition for IC Final Manufacturing gathering Advanced Equipment, Materials and Services.

Official websiteRegisterAgenda
9 months until it opens.

The essentials

Event details

Dates
12 May 2027 to 14 May 2027
Location
Intex Osaka, Osaka, Japan
Organiser
RX Japan
Industry
Hardware & IoT

Agenda themes

Topics covered

  • electronic design
  • R&D
  • manufacturing
  • semiconductor
  • packaging
  • pcb
  • smt
  • Asia
  • exhibition
  • Japan

Logistics

Where to stay

Places to stay near the venue.

  • カンデオホテルズ大阪ザ・タワー

    190 m from the venue

    1-1-27 Dojimahama, Osaka-shi Kita-ku , Osaka, 530-0004

    MapHotel site

  • 相鉄フレッサイン

    260 m from the venue

    Map

  • The Rise Osaka Kitashinchi

    270 m from the venue

    MapHotel site

  • WELCOME INN YODOYABASHI

    280 m from the venue

    Map

  • 御宿 野乃 大阪淀屋橋

    410 m from the venue

    19

    MapHotel site

  • 三交イン

    440 m from the venue

    Map

  • HOTEL KEIHAN

    460 m from the venue

    Map

  • ホテルユニゾ

    460 m from the venue

    Map

Keep planning

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