IC & Sensor Packaging Expo Japan - Tokyo

The essentials

Event details

Dates

17 February 2027 to 19 February 2027

Location

Tokyo International Exhibition Center (Tokyo Big Sight), Tokyo, Japan

Organiser

RX Japan

Industry

Manufacturing

Agenda themes

Topics covered

• electronic design
• R&D
• manufacturing
• semiconductor
• packaging
• pcb
• smt
• Asia
• exhibition
• Japan

Logistics

Where to stay

Places to stay near the venue.

• ハイアットリージェンシー東京

  140 m from the venue

  新宿区, 160-0023

  MapHotel site+81 3-3348-1234

• keio plaza hotel

  200 m from the venue

  Map

• 京王プラザホテル

  250 m from the venue

  1, 新宿区, 160-8330

  MapHotel site+81 3-3344-0111

• 新宿ワシントンホテル

  310 m from the venue

  Map

• THE KNOT TOKYO Shinjuku

  320 m from the venue

  Map

• Hilton Tokyo ★★★★

  360 m from the venue

  2, 新宿区, 160-0023

  MapHotel site+81 3 334 45111

• かどやホテル

  400 m from the venue

  Map

• 京王プレッソイン新宿

  420 m from the venue

  Map

Keep planning

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