Hardware & IoT

INTERNATIONAL ELECTRONIC COMPONENTS TRADE SHOW

Name: INTERNATIONAL ELECTRONIC COMPONENTS TRADE SHOW
Start: 2027-02-17
End: 2027-02-19
Location: Tokyo International Exhibition Center (Tokyo Big Sight)

International Exhibition Specialized in Conducting Business Discussions for Custom-Made, Technical Consultation and Components Procurement of all Kinds of Electronic Components and Devices.

Official website Register Agenda

7 months until it opens.

The essentials

Event details

Dates: 17 February 2027 to 19 February 2027
Location: Tokyo International Exhibition Center (Tokyo Big Sight), Tokyo, Japan
Organiser: RX Japan
Industry: Hardware & IoT

Agenda themes

Topics covered

Electronic Components
Electronic Materials
Circuit board materials
Semiconductor packaging materials/adhesives
Advanced films
electronic design
R&D
manufacturing
semiconductor
packaging
pcb
smt

On stage

Speakers

Thorsten Meyer, Senior Principal, Package Concept Engineering, Infineon Technologies AG
Tomoyuki Yamazaki, Senior Manager, Fuji Electric Co., Ltd
Shinichi Izuo, Dept. manager, Mitsubishi Electric Corp
Ryo Fuchizaki, Engineer, ROHM Co., Ltd

Logistics

Where to stay

Places to stay near the venue.

ハイアットリージェンシー東京
140 m from the venue
新宿区, 160-0023
Map Hotel site +81 3-3348-1234
keio plaza hotel
200 m from the venue
Map
京王プラザホテル
250 m from the venue
1, 新宿区, 160-8330
Map Hotel site +81 3-3344-0111
新宿ワシントンホテル
310 m from the venue
Map
THE KNOT TOKYO Shinjuku
320 m from the venue
Map
Hilton Tokyo ★★★★
360 m from the venue
2, 新宿区, 160-0023
Map Hotel site +81 3 334 45111
かどやホテル
400 m from the venue
Map
京王プレッソイン新宿
420 m from the venue
Map

Keep planning

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