Hardware & IoT
International Symposium on Microelectronics and Packaging (ISMP cor)
The 24th International Symposium on Microelectronics Packaging (ISMP 2026) is a conference focused on microelectronics packaging. It is organized by the Korean Microelectronics Packaging Society and includes plenary, keynote, and invited speakers. The event is intended for professionals and researchers in the microelectronics packaging field.
The essentials
Event details
- Dates
- 3 November 2026 to 6 November 2026
- Organiser
- KMEPS
- Industry
- Hardware & IoT
On stage
Speakers
- Terry Kang, Member of Technical Staff, OpenAI Inc., USA
- Ji Yong Park, Vice President, SK hynix Inc., Korea
- Bill En, Corporate Vice President, AMD (Advanced Micro Devices, Inc.), USA
- KyungRok Park, Corp. Vice President, Amkor Technology Korea, Inc., Korea
- Zsolt Tokei, Fellow, IMEC (Interuniversity Microelectronics Centre), Belgium
- Won Kyoung Choi, Vice President, Samsung Electronics Co., Ltd., Korea
- Nandish Mehta, Senior Research Scientist, NVIDIA Corporation, USA
- Chris Scanlan, Senior Vice President, BESI (BE Semiconductor Industries NV), Switzerland
On the floor
Sponsor
- LG화학
Logistics
Where to stay
Places to stay near the venue.
Keep planning
Related events
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