Hardware & IoT
International Symposium on Microelectronics and Packaging (ISMP cor)
The 24th International Symposium on Microelectronics Packaging (ISMP 2026) is a conference focused on microelectronics packaging. It is organized by the Korean Microelectronics Packaging Society and includes plenary, keynote, and invited speakers. The event is intended for professionals and researchers in the microelectronics packaging field.
The essentials
Event details
- Dates
- 3 November 2026 to 6 November 2026
- Organiser
- KMEPS
- Industry
- Hardware & IoT
On stage
Speakers
- Terry KangMember of Technical Staff, OpenAI Inc., USA
- Ji Yong ParkVice President, SK hynix Inc., Korea
- Bill EnCorporate Vice President, AMD (Advanced Micro Devices, Inc.), USA
- KyungRok ParkCorp. Vice President, Amkor Technology Korea, Inc., Korea
- Zsolt TokeiFellow, IMEC (Interuniversity Microelectronics Centre), Belgium
- Won Kyoung ChoiVice President, Samsung Electronics Co., Ltd., Korea
- Nandish MehtaSenior Research Scientist, NVIDIA Corporation, USA
- Chris ScanlanSenior Vice President, BESI (BE Semiconductor Industries NV), Switzerland
On the floor
Sponsor
- LG화학
Logistics
Where to stay
Places to stay near the venue.
EZSTAY Nampo Hotel
30-13 광복로67번길, 부산광역시, 48949
Hotel Foxy
Elysee Hotel
Aria Hotel
호텔 아벤트리 부산
6 광복로39번길
So Yu Hotel
Boutique Hotel YTT
Sam won jung
Stay on it
Get the next edition
When International Symposium on Microelectronics and Packaging (ISMP cor) announces its next edition, or these dates change, we read it from the organiser's own site. One email when that happens, nothing else.
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