Manufacturing

Warsaw Pack - International Trade Fair for Packaging Technologies and Finished Packagings

Warsaw Pack is an International Trade Fair for Packaging Technology and Packaging Equipment, focusing on comprehensive solutions, innovation, business, and practical solutions for the packaging industry. It is a leading trade fair for the packaging industry.

Official websiteRegister
8 months until it opens.

The essentials

Event details

Dates
13 April 2027 to 15 April 2027
Location
Warsaw, Poland
Address
Al. Katowicka 62,05-830 Nadarzyn
Organiser
Ptak Warsaw Expo
Expected attendance
26,433
Industry
Manufacturing

Public discussion

What people are saying

Agenda themes

Topics covered

  • Packaging Machinery and Production Lines
  • Packaging, Films and Packaging Materials
  • Labeling, Coding and Package Printing
  • Robotics, Automation and Industry 4.0
  • Quality Control, Weighing and Inspection
  • Logistics, Warehousing and Packaging Transport
  • Production Software and Digitalization
  • Sustainable Packaging and Recycling
  • Industrial Components, Pneumatics and Engineering
  • Packaging for the Food and Pharmaceutical Industries
  • Packaging Design, Branding and Finishing
  • Industry Associations and International Platforms

On stage

Speakers

  • Maciej Foltyn
  • Jacek Nogacki
  • Piotr Sibilski
  • Paulina Szadorska
  • Andrzej Walitza
  • Anita Frydrych
  • Michał Malka
  • Paulina Chłopik
  • Karolina Rudnicka
  • Dorota Ostrowska
  • Tomasz Gwizda
  • Jakub Pędziński
  • Piotr Okurowski
  • Krzysztof Niczyporuk
  • Prof. Sandra Muižniece-Brasava
  • Luciana Pellegrino
  • Dr Johannes Bergmair CPP
  • Chakravarthi AVPS
  • Iva Werbynská
  • Zbigniew Rusinek
  • Tomasz Siewierski
  • Marcin Achciński
  • Katarzyna Grabarska
  • Anna Bizon

On the floor

Sponsors and partners

  • HG ROBOTICS
  • MALUKA
  • WEINDICH

Logistics

Where to stay

Places to stay near the venue.

Keep planning

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